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BGA rework station WDS-700 for motherboard Repair Iphone/Samsung/Oppo/Vivo/MI/LG

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BGA rework station WDS-700 for motherboard Repair Iphone/Samsung/Oppo/Vivo/MI/LG


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Categories: PRODUCT CATEGORIES/ Repairing Tools

BGA rework station WDS-700 for motherboard Repair Iphone/Samsung/Oppo/Vivo/MI/LG
 

Updated functions:

A.   Newest WDS-700 is the updated system with 5 modes.It's Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.It can be used under automatic,semi-auto & manual mode.smd bga rework station

B.  Optical Alignment Aystem BGA Rework Station are widely used to replace and repair the BGA chip in mobile phone, laptop, computer, xbox360, PS2, PS3, PS4,etc.

C.  The main user is repairing shops and factory to provide the after-sales service and rework.
 
Repair Steps:
1) Separate the BGA chip from mother board –we called desoldering
2) Clean Pad
3) Reballing  or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) Replace a new BGA chip - we called Soldering
More Details of WDS-700 BGA Rework Machine

1:

Superior function

Auto soldering desoldering mounting BGA/IC

2:

Power supply

AC 220V±10% 50/60Hz

3:

Total power

Max 2500W

4:

Heater power

Upper temp.zone 1200W,Down temp.zone 1200W

5:

Electrical material

Driving motor+PLC smart temp.controller+color touch screen

6:

Temperature controlling

(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃

7:

Locating way

V shape slot,PCB support jigs can adjust

8:

PCB size

Max 140×160mm Min 5×5 mm

9:

Applicable chips

Max 80×80mm Min 1×1 mm

10:

Overall dimension

L450×W470×H670mm

11:

Temperature Interface

1 pc

12:

Weight of machine

30KG

13:

Color

Blue+White Optical alignment system BGA rework station

 

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BGA rework station WDS-700 for motherboard Repair Iphone/Samsung/Oppo/Vivo/MI/LG

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