Qianli iAtlas 24k Explosion Proof Gold-plated Foil Gasket for Phone Motherboard Reballing Repair

Features:

• 24K gold plating process / better oxidation resistance / better conductivity / explosion-proof tin is stronger

• New inventions in the industry, improve the success rate of maintenance, and gain one step faster

• Fitted with explosion-proof tin, there is support, no fear of deformation "pressing"

• Gold-plated, easy to tin, strong conductivity, simple and practical

• Breaking through precision maintenance standards, experts improve efficiency, and novices reduce manual dependence

• The "top pillar" of precision electronic hardware. During the maintenance process, take out the required gold-plated gasket and place the gasket on the required support point.

• After the gasket is added, a reasonable gap will be increased, so that there is no overflow between the motherboard and the tin paste

• The motherboard is slightly deformed, and it can be supported by spacers

• The fit is more stable, and there is no fear of micro-deformation of the motherboard

• Convenient and easy to take, easy to use with clip

• Wide range of use, middle frame, chip, BGA, all can be used, general electronic components that need to be attached

QianLi iAtlas Solder Explosion Proof 24K Gold-plated Foil

soler explsion when reballing, tin adhesion, avoid pressing due to crooked motherboard

Details Images

Package includes:

• 3 Bottles of Spacers(About 1650Pcs Spacers)