TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair
TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair Voltage：110V-220V Power：100W Laser power:55W heating temperature：100-450℃ microscope：4KCCD pixel：4800万
Voltage:
- $1,416.40
-
Quantity Price 1- $1,416.40
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Categories: BRAND ACCESSORIES/ TBK
TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair
1)Thermal imaging and high-definition diagnostic function-Automatic detection of positive and negative pole thermal imaging mainboard connection.when the power supply temperature is too high, you can notice it.
2)Precise constant temperature control on laser heating;
3)Low power consumption (55W ) but fast heating;
4)No thermal radiation, no influence on working ambient temperature;
5)Space heating solder,;
6)Easy to operate for chip maintenance!
7)Aviation grade all aluminium fuselage (net weight is only 6.2 Kg)
TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair
1)Thermal imaging and high-definition diagnostic function-Automatic detection of positive and negative pole thermal imaging mainboard connection.when the power supply temperature is too high, you can notice it.
2)Precise constant temperature control on laser heating;
3)Low power consumption (55W ) but fast heating;
4)No thermal radiation, no influence on working ambient temperature;
5)Space heating solder,;
6)Easy to operate for chip maintenance!
7)Aviation grade all aluminium fuselage (net weight is only 6.2 Kg)
