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Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max Middle Layer Motherboard

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Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13/13 Mini/13 Pro/13 Pro Max Middle Layer Motherboard Features: Mijing 4 in 1 BGA Reballing Stencil Platform for iPhone 13/ 13 Pro/ 13Pro Max/13Mini, convenient and faster for reballing BGA without any


  • $24.73
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Categories: BRAND ACCESSORIES/ MIJING Tools

Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13/13 Mini/13 Pro/13 Pro Max Middle Layer Motherboard

Features:
  • Mijing 4 in 1 BGA Reballing Stencil Platform for iPhone 13/ 13 Pro/ 13Pro Max/13Mini, convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 13 series BGA reballing and repairing
 
How to use:
  • Install the main board on the platform
  • Cover the BGA reballing stencil on the mainboard
  • Evenly spread tin on the cover of the reballing stencil
  • Remove the reballing stencil cover
  • Take out the motherboard and cooperate with the hot air gun to solidify the tin point
 
Package includes:
  • 1 x Fixture
  • 4 x Steel mesh
Mijing Z20 4-in-1 BGA Reballing Platform for iPhone 13/13 Mini/13 Pro/13 Pro Max Middle Layer Motherboard

Features:
  • Mijing 4 in 1 BGA Reballing Stencil Platform for iPhone 13/ 13 Pro/ 13Pro Max/13Mini, convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 13 series BGA reballing and repairing
 
How to use:
  • Install the main board on the platform
  • Cover the BGA reballing stencil on the mainboard
  • Evenly spread tin on the cover of the reballing stencil
  • Remove the reballing stencil cover
  • Take out the motherboard and cooperate with the hot air gun to solidify the tin point
 
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