Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A16 / Hisilicon / Qualcomm Snapdragon
Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A16/Hisilicon/Qualcomm Snapdragon Features: Automatic precise positioning The new magnetic dynamic original positioning Strong magnetic force automatic clamping
Model:
- $19.12
-
Quantity Price 1- $19.12
Product is In Stock
Quantity
Categories: BRAND ACCESSORIES/ MIJING Tools
Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A16/Hisilicon/Qualcomm Snapdragon
Features:
- Automatic precise positioning
- The new magnetic dynamic original positioning
- Strong magnetic force automatic clamping
Installation Method:
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
- 1 x Tin planting platform set
Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A16/Hisilicon/Qualcomm Snapdragon
Features:
- Automatic precise positioning
- The new magnetic dynamic original positioning
- Strong magnetic force automatic clamping
Installation Method:
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
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