WL 0.12MM Multi-Function BGA Reballing Stencil Plant Tin Steel Net With CPU Holes for iPhone Xs / XR / Xs Max A12 CPU / font / audio / power IC / USB control IC BGA Reballing Stencil Template.
IC Chip BGA Reballing Stencil Tin Steel Net for iPhone X / 8 Plus / 8, iPhone HDD PCIE / Baseband Repair BGA Reballing Net With Fixed Plate, Easy to use and more accurate IC welding position
SS-905D Android Smart Power Cable
SS-905D 3 wire Smart power cable
Universal Android Model
Applicable IPhone models
Over-voltage automatic power off
High-quality copper core wire
Equipped with identification resistor
PCB battery buckle small board
RL-056B
Glue cutting 2 in 1 artifact
Glue cutting machine
Say goodbye to hand gel, free of glue removal liquid, safer
With cutting function, precise adjustment
High Power
Comfortable grip
Positive reversal
Adjustable shifting
The stick can be replaced
Features:
1.6 in 1 design, which can implant a plurality of chips.
2.These stencils were made of high quality stainless steel plate, the thickness of steel mesh is appropriate.
3.It adopted the special plump design which can avoid dissipation.
4.It
Amao M80 Repair Pad Synthetic Stone Mat with IC Buckle
Features:
Integrated fast glue removal design, which can basically remove glue from all chips on mobile phones.
Fast glue removal design, the buckle can be pushed up and down, and the chip is clamped