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MECHANIC constant temperature IPHONE X Motherboard lamination Separate layer remove glue Layering and dismounting platform

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MECHANIC constant temperature IPHONE X Motherboard lamination Separate layer remove glue Layering and dismounting platform


  • $33.16
  • Quantity Price
    1- 8 $33.16

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Categories: Mobile Repair Equipment/ Repairing Tools

MECHANIC constant temperature IPHONE X Motherboard lamination Separate layer remove glue Layering and dismounting platform

  • 100% brand new, high quality
  • No need the hot air rework station
  • Use for iPhone x motherboard separate, remove glue
  • One button for power ON/OFF, easy use
  • Mini size, can put under microscope for use,easy to observe
  • Size:97mm*81mm
  • Voltage: 220V in one

Package include:
1 x Mechanic IX5

 
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MECHANIC constant temperature IPHONE X Motherboard lamination Separate layer remove glue Layering and dismounting platform

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